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Description

Size :
174*79.68mm
Layer :
2 Layers
Material :
FR-4: TG130
Thickness :
1.6 mm
Min Track/Spacing :
6/6mil
Min Hole Size :
0.3mm ↑
Solder Mask :
Blue
Silkscreen :
White
Gold fingers :
No
Surface Finish :
HASL with lead
“HASL” to “ENIG”
Yes
Via Process :
Tenting vias
Finished Copper :
1 oz Cu

 

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Additional information

Weight0.074 kg

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